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    Model:TPC-DCP185HT
    ● Modular & Fanless designed, aluminum-magnesium alloy;
    ● Intel 11th Gen. Tiger Lake UP3, Celeron, Core i3/i5/i7 CPUs;
    ● Widescreen 18.5” TFT LCD Display, LED Backlit, FHD 1920*1080;
    ● Multi up to 10 points Pcap. touchscreen, EETI controller;
    ● DC 9~36V input, with over-current, over-voltage, polarity protection;
    ● I/O interfaces: 5 GbE (4 PoE), 4 USB3.0, 2 COM, 1 HDMI;
    ● Intel PTT TPM2.0, Support Windows 11 OS;
    ● Panel mount, VESA 75/100 mount, Front IP65 rated protection;
    ● Optional 1 Mini-PCIe Expansion slot.
    Basic introduction
    Specification
    Dimension Layout
    Download
    Ordering Information
     
    Hardware & System BIOS SPI AMI EEI BIOS
    CPU Intel 11th Gen. Tiger Lake UP3 Celeron 6305E, Core i3-1115G4, Core i5-1135G7, Core i7-1195G7
    TDP Default 15W (BIOS Configured)
    Graphic Intel UHD/Iris Xe Graphics
    Memory SO-DIMM, Support DDR4 3200 Mhz, Max. up to 32GB
    Storage 1* M.2 2280 M-Key SSD, 1* 2.5” SATA SSD
    Network 5* Intel i210AT, Optional wireless 3G/4G/LTE, Wi-Fi/BT
    Expansion 1* Full size Mini-PCIe slot
    Watch dog 0 ~ 256 seconds programmable
    Operating System Win10, Win11, Linux, Ubuntu
    I/O Interface Ethernet 5 RJ45, 10/100/1000 Mbps, 4 support PoE 802.3 AF (Single port max. up to 15.4W, total less than 45W)
    COM 2* RS232 by default (Optional 1* RS485 or GPIO)
    USB 4* USB3.0
    Display 1* HDMI
    Power 1* 2 Pins, Phenix Terminal
    LCD Display Size/Type 18.5” TFT LCD Display
    Resolution 1920* 1080 (FHD)
    Brightness 350 nits
    Backlit & Lifetime LED Backlit & 50K hours
    Display Area 408.96 * 230.4 (mm)
    View Angle 85/85/85/85
    Touchscreen Type Projective capacitive touchscreen
    Touch points Multi points touch, max. up to 10 points
    Durability >100 000 000 times
    Surface Hardness MOHS 6H
    Touch Controller EETI
    Special Treatment Anti-Fingerprint (AF)
    Structure Structure & Surface Magnesium-Aluminum alloy, sand blasting, anodized treated
    Cooling System Large area finned heatsink (Fanless designed)
    Overall Dimension 462.4 * 296.6 * 57.5 (mm)
    Cut-out Dimension 451* 276 (mm)
    Net Weight 5.6 KG
    Mount Method Panel mount, VESA 75/100 Mount
    Power & Environmental Operating temp. -20 ~ + 60 ()
    Storage temp. -30 ~ + 70 (
    Humidity 10 ~ 95% @ 10C (No condensation)
    Vibration 50 ~ 500 Hz, 1.5G, 0.15mm peak to peak
    Shock 10G/Peak (11 ms)
    Power input DC 9~36V
    Power consumption About 40W
    Certificate CE/FCC/ROHS

     
     
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