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TAICENN TPC-DCS/DRS T – Newest Modular Industrial Panel PCs with Intel 11th Gen. Tiger Lake UP3 processors
Release Time:2023/1/16 Number Of Clicks:387
TAICENN Newest Modular Industrial Tiger Lake UP3 Panel PCs
TAICENN has launched our newest modular industrial touchscreen Panel PC series, the TPC-DCS/DRS T. The Panel PC series is a ruggedized, fan-less design with full dimensions (from 15.0” to 21.5”) that’s crystal clear for both still imaging and streaming video. As always, this new series HMI Panel PCs shares the same cut-out dimension on both Pcap. touch (TPC-DCS T) and high temp. 5-wires resistive touch (TPC-DRS T). It is modular designed and manufactured by the standard Pcap. and resistive touch display modules and computer modules.

The newest released Tiger Lake Panel PC system is powered by Intel’s 11th Gen. Intel Tiger Lake UP3 SoC super high computing platform (Celeron 6305E, Core i3-1115G4, Core i5-1135G7, Core i7-1165G7) processors to provide an accelerated computing performance. The integrated Intel Iris Xe Graphics built with innovative GPU architecture are able to optimize image and video handling capabilities.

The new TPC-DCS/DRS T industrial HMI embedded system support TPM2.0 (PTT2.0) and Windows 11 Operating systems, and 2* M.2 high speed expansional modules. The HMI PC system supports WiFI/BT, 3G/4G, and 5G cellular connectivity. It’s an ideal solution f various of industrial projects, including Machine-to-Machine (M2M), smart building automation, industrial automation, Industrial Internet of Things (IIoT), smart manufacturing, industry 4.0, commercial automation

Outstanding performance - Intel's newest 11th Gen. Tiger Lake UP3
TPC-DCS/DRS T industrial HMI Panel PCs adopts Intel's newest 11th Gen. Tiger Lake UP3 chips. The 11th Gen. Intel® Core™ processors deliver a balance of performance and responsiveness in a low-power platform built on our third-generation 10nm process technology. Engineered to deliver for IoT markets, these processors can support low-latency and time-sensitive applications, and have the power to run multiple workloads including AI and deep learning applications on a single platform. (Source from Intel). 
TAICENN Newest Modular Industrial Tiger Lake UP3 Panel PCs
Rich IOs and expansions - meet different industrial needs
The rugged touch Panel PC is designed with rich IO interfaces, 2* GbE, 6* USB3.0, 2* RS232 COM (optional 1* RS485), 2* HDMI, Audio, can meet different interface requirements and help information transmission more smoothly. It is designed with two high speed expansion slots (1* M.2 Key-B and 1* M.2 Key-E), can optional support 3G/4G, 5G, Wi-Fi/BT wireless expansion. Also, TPC-DCS/DRS T provides more powerful expansion possibilities, and offer flexible and fast expansions for industrial field applications to improve product performance.

Main features:
High strength aluminum alloy, anodized and painting treatment;
Available: 15.0”XGA, 15.6”WXGA, 15.6”FHD, 17.0”SXGA, 18.5”WXGA, 18.5”FHD, 19.0”SXGA and 21.5”FHD;
On-board Intel 11th Gen. Tiger Lake UP3 Celeron 6305E, Core i3-1115G4, Core i5-1135G7, Core i7-1165G7 processors;
Intel PTT TPM2.0, support to install Win11 OS;
Support both Pcap. Touch and 5-wires resistive touch, EETI controller;
1* DDR4 memory, single slot, max. up to 32GB, 
1* M.2 2280(PCIe NVMe) SSD, and 1* 2.5” SATA SSD;
DC 12V input, optional wide voltage DC 9~36V input;
2 M.2 Key slots, dual wireless expansion 3G/4G, 5G, WIFI/BT support;
2 GLAN, 6 USB3.0, 2 COM, 2 HDMI, Audio;
Panel mount, support VESA 75/100 mounting method;
Fanless design, slim design, front IP65 rated protection.

Product Image:
TAICENN Newest Modular Industrial Tiger Lake UP3 Panel PCs
Delivery plan:
In our schedule, TPC-DCS/DRS T series products are above to deliver small and middle batch from middle February. Any further information, welcome to contact with TAICENN sales team.

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